ruggedized rack X80 - 12 slots - Ethernet backplane
BMEXBP1200H
OMR 479.566
OMR 479.566
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BMEXBP1200H
ruggedized rack X80 - 12 slots - Ethernet backplane
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Product Details
| Activity | IDPAC |
|---|---|
| Part Number | BMEXBP1200H |
| Accessory / separate part type | ruggedized rack |
| current consumption | 164 mA at 24 V DC, 86 mA at 3.3 V DC |
| fixing mode | by 4 M6 screws, mounting on plate, by 4 screws - diameter: 4.32-6.35 mm, mounting on panel |
| IP degree of protection | IP20 |
| net weight | 1.377 kg |
| product certifications | CE, UL, CSA, RCM, EAC, Merchant Navy, ATEX zone 2/22, IECEx zone 2/22 |
| protective treatment | conformal coating |
| range of product | Modicon X80 |
| relative humidity | 5-95 % without condensation |
| MTBF reliability | 1500000 H |
| Number of slots | 8 bus X + Ethernet, 4 bus X |
| ambient air temperature for operation | -25-70 °C |
| standards | EN/IEC 61131-2, EN/IEC 61010-2-201, UL 61010-2-201, CSA C22.2 No 61010-2-201, IACS E10, EN/IEC 61000-6-5, interface type 1 and type 2, EN/IEC 61850-3, location G, EN/IEC 60079-0 |
| product compatibility | I/O module, BMX processor, specific application module, BMXCPS power supply, BME processor |
| environmental characteristic | gas resistant class Gx conforming to ISA S71.04, gas resistant class 3C4 conforming to IEC 60721-3-3, dust resistant class 3S4 conforming to IEC 60721-3-3, sand resistant class 3S4 conforming to IEC 60721-3-3, salt resistant level 2 conforming to IEC 68252, mold growth resistant class 3B2 conforming to IEC 60721-3-3, fungal spore resistant class 3B2 conforming to IEC 60721-3-3, hazardous location class I division 2 |
| Electrical Connection | 1 connector (XBE) expansion module |
| Directives | 2014/35/EU - low voltage directive, 2014/30/EU - electromagnetic compatibility, 2014/34/EU - ATEX directive |